118-06可移印，B級，導電環(huán)氧粘合劑

說明

118-06是一種可移印、B級可固化、導電、單組分環(huán)氧涂層和粘合劑。118-06罐

也可通過浸漬或注射器配藥來使用。該系統(tǒng)具有良好的熱穩(wěn)定性，的

耐化學性和優(yōu)異的高溫性能。應用包括但不限于粘合

引線框架電容器，組裝電氣和電子元件。適用于較低

需要溫度固化，按照以下說明使用創(chuàng)造性材料119-44固化劑。

特色

『優(yōu)良的導電性』出色的印刷性

“B-可穩(wěn)定”優(yōu)異的高溫性能

優(yōu)異的耐化學性

典型未固化特性

財產價值單位

粘度-布魯克菲爾德帽子粘度計

@25℃下10轉/分11000 cps

比重2.49水=1

填料銀不適用

銀含量（固化）>70%

理論覆蓋率@0.001“濕厚度24 in2

/克

固體84%

彩銀不適用

典型固化性能

財產價值單位

工作溫度-55至+230°C

峰值溫度325°C

體積電阻率0.0008Ω-cm

玻璃化轉變溫度-TG 100攝氏度

熱膨脹系數(shù)50 ppm/oC

T-抗剪強度2100 psi

300℃時體重減輕，TGA 2.77%

差示掃描量熱法

溫度168攝氏度

ΔHC-33.4焦耳/克

所有技術信息均基于CMI人員獲得的數(shù)據(jù)，并被認為是可靠的。不

對于結果或可能侵犯的行為，保證是明示或暗示的。

搬運和儲存

118-06是單組分環(huán)氧樹脂系統(tǒng)，可在收到時使用。產品應冷藏至

保持*的流動特性。打開容器前，讓118-06預熱至室溫。

使用前，充分混合，重新懸浮填料。如果需要，118-06可以用少量

創(chuàng)意材料113-39（快干）或114-20（慢干）稀釋劑。

保質期

儲存溫度容器注射器B級薄膜

25攝氏度2個月不適用1個月

-10攝氏度6個月6個月3個月

CMI 119-44使用說明

按重量從119-44的1份添加到118-06的100份，并充分混合。

使用119-44的固化指南：80°C 4小時

100°C 2小時

這些溫度和時間表示為

僅供參考。鼓勵終用戶

確定養(yǎng)護制度的試驗。

所有技術信息均基于CMI人員獲得的數(shù)據(jù)，并被認為是可靠的。不

對于結果或可能侵犯的行為，保證是明示或暗示的。

修訂日期：5/22/07修訂日期：E

B階段程序

在基材上涂上粘合劑。加熱至非粘性階段（冷卻至室內時）提前固化

溫度）。需要125℃的溫度2-3分鐘（B級時間與質量有關）。用戶是

鼓勵在給定溫度下試驗干燥時間。存放在釋放襯墊上以防止

污染。

粘合程序

若要使用，請小心對齊要粘合的零件，施加均勻的壓力以保持位置。遵循固化指南

以上給出。膠粘劑和基材達到固化溫度后，應開始計時。

細節(jié)

一。和所有的粘合劑一樣，表面處理是整個過程中至關重要的一部分。仔細清潔兩個

如有可能，表面應與MEK粘合。如果MEK與要粘合的表面不兼容，

可以使用另一種合適的溶劑。

2.使清潔后的表面*干燥。

三。模切118-06至接口區(qū)域尺寸，取下其中一個保護套，定位到

其中一個待粘合表面，并將基材/粘合劑加熱至50°C-70°C。

四。通過施加輕微的壓力，將薄膜/粘合劑層壓到基底上，以消除任何滯留的空氣。

讓其冷卻至室溫并剝去另一個釋放襯墊。

5個。放置另一個基板，并使用夾具提供恒定壓力。

6.按照之前的指南進行治療。

7號。消除壓力。零件已準備好使用。

健康與安全

在充分通風的情況下使用。遠離火花和明火。避免長時間接觸皮膚和

吸入蒸汽。用肥皂和水清洗皮膚。

118-06可移印，B級，導電環(huán)氧粘合劑

 118-06
PAD PRINTABLE, B-STAGEABLE, ELECTRICALLY CONDUCTIVE EPOXY ADHESIVE
DESCRIPTION
118-06 is a pad-printable, B-Stageable, electrically conductive, one part epoxy coating and adhesive. 118-06 can
also be applied by dipping or syringe dispensing. This system features excellent thermal stability, outstanding
chemical resistance and excellent high temperature properties. Applications include, but are not limited to bonding
capacitors to lead frames, assembling electrical and electronic components. For applications where a lower
temperature cure is required, use Creative Materials’ 119-44 curative per instructions below.
UNIQUE FEATURES
¯ Excellent Electrical Conductivity ¯ Outstanding Printability
¯ B-Stageable ¯ Excellent High Temperature Performance
¯ Excellent Chemical Resistance
TYPICAL UNCURED PROPERTIES
Property Value Units
Viscosity – Brookfield HAT Viscometer
@ 10 rpm @ 25ºC 11,000 cps
Specific Gravity 2.49 water = 1
Filler Silver N/A
Percent Silver (cured) >70 %
Theoretical Coverage @ 0.001” Wet Thickness 24 in2
/gram
Solids 84 %
Color Silver N/A
TYPICAL CURED PROPERTIES
Property Value Units
Operating Temperature -55 to +230 °C
Peak Temperature 325 °C
Volume Resistivity 0.0008 Ω - cm
Glass transition Temperature – Tg 100 ºC
Coefficient of Thermal Expansion 50 ppm/ºC
T-Shear Strength 2100 Psi
Weight Loss @ 300ºC, TGA 2.77 %
Differential Scanning Calorimetry (DSC)
 Peak Tc 168 ºC
 ? Hc -33.4 J/g
All technical information is based on data obtained by CMI personnel and is believed to be reliable. No
warranty is either expressed or implied with respect to results or possible infringements on patents.
HANDLING AND STORAGE
118-06 is a one component epoxy system and is ready to use as received. Product should be stored frozen to
maintain consistent flow properties. Allow 118-06 to warm up to room temperature before opening container.
Prior to using, mix thoroughly to re-suspend fillers. If needed, 118-06 can be thinned with small amounts of
Creative Materials’ 113-39 (fast drying) or 114-20 (slow drying) thinners.
 SHELF LIFE
Storage Temperature Containers Syringes B-Staged Film
 25º C 2 months N/A 1 month
-10º C 6 months 6 months 3 months
INSTRUCTIONS FOR USE WITH CMI 119-44
Add 1 part of 119-44 to 100 parts of 118-06 by weight and mix thoroughly.
Curing guidelines using 119-44: 80° C 4 hours
100°C 2 hours
These temperatures and times are presented as a
guide only. The end-user is encouraged to
experiment to determine optimum curing schedule.
All technical information is based on data obtained by CMI personnel and is believed to be reliable. No
warranty is either expressed or implied with respect to results or possible infringements on patents.
REVISION DATE: 5/22/07 REVISION: E
B-STAGE PROCEDURE
Apply adhesive to substrate. Apply heat to advance curing to the non-tacky stage (when cooled to room
temperature). A temperature of 125º C for 2 – 3 minutes is required (B-stage time is mass related). The user is
encouraged to experiment for optimum drying time at a given temperature. Store on release liner to prevent
contamination.
BONDING PROCEDURE
To use, carefully align parts to be bonded, apply uniform pressure to maintain location. Follow curing guidelines
given above. Timing should start once adhesive and substrate reach curing temperature.
Details
1. As with all adhesive bonds, surface preparation is a vital part of the process. Carefully clean both
surfaces to be bonded with MEK if possible. If MEK is not compatible with the surfaces to be bonded,
another suitable solvent may be used.
2. Allow cleaned surfaces to dry completely.
3. Die cut 118-06 to the of the size of interface area, remove one of the protective liners, position onto
one of the surfaces to be bonded, and warm the substrate/adhesive to 50°C-70°C.
4. By applying slight pressure, laminate the film/adhesive to the substrate smoothing out any trapped air.
Allow to cool to room temperature and peel off the other release liner.
5. Position the other substrate and apply a clamp to provide constant pressure.
6. Cure per previous guidelines.
7. Remove pressure. Part is ready for use.
HEALTH AND SAFETY
Use with adequate ventilation. Keep away from sparks and open flames. Avoid prolonged contact with skin and
breathing of vapors. Wash with soap and water to remove from skin.