122-07 （SP）高導(dǎo)熱環(huán)氧樹脂模壓粘合膠
說明
122-07SP是一種絲網(wǎng)印刷，B-耐老化，高導(dǎo)熱，單組分環(huán)氧涂層和粘合劑。
DESCRIPTION
122-07SP is a screen-printable, B-Stageable, highly thermally conductive, one part epoxy coating and adhesive.

122-07 (SP)高導(dǎo)熱環(huán)氧樹脂模壓粘合膠

說明

122-07SP是一種絲網(wǎng)印刷，B-耐老化，高導(dǎo)熱，單組分環(huán)氧涂層和粘合劑。

該系統(tǒng)具有優(yōu)異的熱穩(wěn)定性、優(yōu)異的耐化學(xué)性和優(yōu)異的高溫性能

財(cái)產(chǎn)。應(yīng)用領(lǐng)域包括模壓粘合劑、印刷電路板制造、高級(jí)材料

復(fù)合材料、密封和高性能涂層。

特色

優(yōu)異的導(dǎo)熱性優(yōu)異的印刷適性

B-可分級(jí)屏幕壽命長

優(yōu)異的耐化學(xué)性優(yōu)異的高溫性能

低離子

離子含量

氯化物<10ppm

鈉<10ppm

鉀<10ppm

（典型特性不用作規(guī)范限值）

典型未固化特性

財(cái)產(chǎn)價(jià)值單位

粘度-布魯克菲爾德帽子粘度計(jì)

@25°C 23000 cps時(shí)為10轉(zhuǎn)/分

比重1.85水=1

理論覆蓋率@0.001“厚度1 30 in2

屏幕壽命8小時(shí)

固體87%

彩色膩?zhàn)硬贿m用

1取決于篩網(wǎng)和材料

典型固化性能

財(cái)產(chǎn)價(jià)值單位

導(dǎo)熱系數(shù)5.5 w/mk

介電強(qiáng)度440伏/密耳

體積電阻率1 x 1016歐姆-厘米

介電常數(shù)5.2 1赫茲

介電系數(shù)0.018 60赫茲

熱穩(wěn)定性高達(dá)325攝氏度

有效溫度范圍-55至230攝氏度

玻璃化轉(zhuǎn)變溫度-TG 100攝氏度

熱膨脹系數(shù)-低于TG 29.5 x 10-6 in/in/℃

-高于TG 13.5 x 10-5英寸/英寸/攝氏度

所有技術(shù)信息均基于CMI人員獲得的數(shù)據(jù)，并被認(rèn)為是可靠的。不

對于結(jié)果或可能侵犯的行為，保證是明示或暗示的。

修訂日期：3/9/07修訂版：C

典型固化性能

財(cái)產(chǎn)價(jià)值單位

動(dòng)態(tài)拉伸模量-65°C 8780兆帕

25°C 6710兆帕

150°C 182兆帕

200°C 152兆帕

T-抗剪強(qiáng)度1800 psi

300°C時(shí)的體重減輕，TGA 2.98%

差示掃描量熱法

峰值溫度184°C

ΔHC-28.7焦耳/克

122-07（SP）熱重分析

溫度-℃

重量百分比（%）

固化指南

溫度（攝氏度）時(shí)間（分鐘）

150 60個(gè)

17530個(gè)

200 15個(gè)

搬運(yùn)和儲(chǔ)存

122-07（SP）是單組分環(huán)氧樹脂系統(tǒng)，可在收到時(shí)使用。產(chǎn)品應(yīng)冷藏至

保持*的流動(dòng)特性。打開前讓122-07（SP）預(yù)熱至室溫

集裝箱。使用前，充分混合，重新懸浮填料。如果需要，122-07（SP）可以用

創(chuàng)作材料的數(shù)量'113-12稀薄。

保質(zhì)期

儲(chǔ)存溫度容器B級(jí)薄膜

25°C 2個(gè)月1個(gè)月

-10°C 6個(gè)月6個(gè)月

這些溫度和時(shí)間表示為

僅供參考。鼓勵(lì)終用戶

確定養(yǎng)護(hù)制度的試驗(yàn)。

所有技術(shù)信息均基于CMI人員獲得的數(shù)據(jù)，并被認(rèn)為是可靠的。不

對于結(jié)果或可能侵犯的行為，保證是明示或暗示的。

修訂日期：3/9/07修訂版：C

B階段程序

在基材上涂上粘合劑。加熱至非粘性階段（冷卻至室內(nèi)時(shí)）提前固化

溫度）。要求溫度為125°C，持續(xù)2-3分鐘（B級(jí)時(shí)間與質(zhì)量有關(guān)）。用戶是

鼓勵(lì)在給定溫度下試驗(yàn)干燥時(shí)間。存放在釋放襯墊上以防止

污染。

粘合程序

若要使用，請小心對齊要粘合的零件，施加均勻的壓力以保持位置。遵循固化指南

以上給出。膠粘劑和基材達(dá)到固化溫度后，應(yīng)開始計(jì)時(shí)。

健康與安全

在充分通風(fēng)的情況下使用。遠(yuǎn)離火花和明火。避免長時(shí)間接觸皮膚和

吸入蒸汽。用肥皂和水清洗以去除皮膚。

122-07 (SP)高導(dǎo)熱環(huán)氧樹脂模壓粘合膠

 122-07 (SP)
HIGHLY THERMALLY CONDUCTIVE, EPOXY DIE ATTACH ADHESIVE
DESCRIPTION
122-07SP is a screen-printable, B-Stageable, highly thermally conductive, one part epoxy coating and adhesive.
This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature
properties. Applications include die attach adhesives, printed circuit board fabrication, advanced material
composites, sealing and high performance coatings.
UNIQUE FEATURES
? Excellent Thermal Conductivity ? Outstanding Printability
? B-Stageable ? Long Screen Life
? Excellent Chemical Resistance ? Excellent High Temperature Performance
? Low Ionics
IONIC CONTENT
Chloride <10ppm
Sodium <10ppm
Potassium <10ppm
(Typical properties are not intended to be used as specification limits)
TYPICAL UNCURED PROPERTIES
Property Value Units
Viscosity – Brookfield HAT Viscometer
@ 10 rpm @ 25°C 23,000 cps
Specific Gravity 1.85 water = 1
Theoretical Coverage @ 0.001” Thickness1 30 in2
Screen Life 8 hrs
Solids 87 %
Color Putty N/A
1 Dependent on screen mesh and material
TYPICAL CURED PROPERTIES
Property Value Units
Thermal Conductivity 5.5 W/mK
Dielectric Strength 440 volts/mil
Volume Resistivity 1 x 1016 ohms - cm
Dielectric Constant 5.2 1 Hz
Dielectric Factor 0.018 60 Hz
Thermal Stability Good to 325 º C
Useful Temperature Range -55 to 230 º C
Glass transition Temperature – Tg 100 º C
Coefficient of Thermal Expansion - Below Tg 29.5 x 10-6 in/in/°C
 - Above Tg 13.5 x 10-5 in/in/°C
All technical information is based on data obtained by CMI personnel and is believed to be reliable. No
warranty is either expressed or implied with respect to results or possible infringements on patents.
REVISION DATE: 3/9/07 REVISION: C
TYPICAL CURED PROPERTIES
Property Value Units
Dynamic Tensile Modulus -65°C 8780 Mpa
 25°C 6710 Mpa
 150°C 182 Mpa
 200°C 152 Mpa
T-Shear Strength 1800 Psi
Weight Loss @ 300°C, TGA 2.98 %
Differential Scanning Calorimetry (DSC)
 Peak Tc 184 °C
 ? Hc -28.7 J/g
122-07(SP) TGA
Temperature - °C
Weight % (%)
CURING GUIDELINES
Temperature (ºC) Time (min.)
 150 60
 175 30
 200 15
HANDLING AND STORAGE
122-07(SP) is a one component epoxy system and is ready to use as received. Product should be stored frozen to
maintain consistent flow properties. Allow 122-07(SP) to warm up to room temperature before opening
container. Prior to using, mix thoroughly to re-suspend fillers. If needed, 122-07(SP) can be thinned with small
amounts of Creative Materials’ 113-12 thinner.
 SHELF LIFE
Storage Temperature Containers B-Staged Film
 25°C 2 months 1 month
-10°C 6 months 6 months
These temperatures and times are presented as a
guide only. The end-user is encouraged to
experiment to determine optimum curing schedule.
All technical information is based on data obtained by CMI personnel and is believed to be reliable. No
warranty is either expressed or implied with respect to results or possible infringements on patents.
REVISION DATE: 3/9/07 REVISION: C
B-STAGE PROCEDURE
Apply adhesive to substrate. Apply heat to advance curing to the non-tacky stage (when cooled to room
temperature). A temperature of 125°C for 2 – 3 minutes is required (B-stage time is mass related). The user is
encouraged to experiment for optimum drying time at a given temperature. Store on release liner to prevent
contamination.
BONDING PROCEDURE
To use, carefully align parts to be bonded, apply uniform pressure to maintain location. Follow curing guidelines
given above. Timing should start once adhesive and substrate reach curing temperature.
HEALTH AND SAFETY
Use with adequate ventilation. Keep away from sparks and open flames. Avoid prolonged contact with skin and
breathing of vapors. Wash with soap and water to remove fro skin.